SEMICONDUCTOR DEVICE, METHOD FOR INSTALLING HEAT DISSIPATION MEMBER TO SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.

主权项

1. A semiconductor device comprising:
a circuit board; a semiconductor element disposed on a first side of the circuit board; a metal substrate disposed on a second side of the circuit board; and a storage member having a storage region, a concave surface, an opening in which the circuit board is disposed with the metal substrate protruding from the concave surface, and fastener holes in the concave surface and configured to allow passage of fasteners.