PREPREG WITH PRIMER LAYER, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a prepreg with a primer layer which can give a printed wiring board having a fine circuit dimension and excellent insulation reliability as well as give a semiconductor package with suppressed warpage. ! SOLUTION: A prepreg 100 with a primer layer comprises: a prepreg 110 prepared by impregnating a fiber base material 101 with a resin composition comprising a naphthylene ether type epoxy resin expressed by general formula (1) shown below and an inorganic filler (A) to form at least one impregnated layer; and a primer layer 103 which is present between a metal layer formed on at least one surface 108 of the prepreg 110 and a cured product obtained by heating and curing the prepreg 110, so as to adhere the metal layer to the cured product. ! COPYRIGHT: (C)2015,JPO&INPIT