发明名称 CONDUCTIVE FILM AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive film which can improve both conduction reliability and insulation reliability when used in electric connection between electrodes. ! SOLUTION: A conductive film 11 includes a plurality of conductive particles 21, a plurality of insulation particles 12 not in contact with the conductive particles 21 and a binder resin 13. In the conductive film 11, the insulation particles 12 are in an uneven distribution. In the conductive film 11, the number density of the insulation particles 12 in a first region R1 closer to the conductive particles 21 than a second region R2 is greater than the number density of the insulation particles 12 in the second region R2 farther from the conductive particles 21 than the first region R1. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2014241281(A) 申请公布日期 2014.12.25
申请号 JP20140100643 申请日期 2014.05.14
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA ; MAHARA SHIGEO ; UENOYAMA SHINYA
分类号 H01B5/16;H01B1/00;H01R11/01 主分类号 H01B5/16
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