| 摘要 |
A semiconductor device includes a semiconductor chip having an electrode, a connector having a chip contact surface, an interconnecting portion, and an external electrode terminal contact surface, the chip contact surface being electrically connected to the electrode, and a first connection material disposed between the chip contact surface and the electrode, the first connecting material having a surface area that is greater than a surface area of the chip contact surface. |
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor chip including an electrode; a connector having a chip contact surface, an interconnecting portion, and an external electrode terminal contact surface, the chip contact surface being electrically connected to the electrode; and a first connection material disposed between the chip contact surface and the electrode, the first connection material having a surface area that is greater than a surface area of the chip contact surface. |
