| 发明名称 |
COMPONENT IN THE FORM OF A WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A vertically integrated hybrid component is implemented in the form of a wafer level package including: at least two element substrates assembled one above the other; a molded upper sealing layer made of an electrically insulating casting; and an external electrical contacting of the component being implemented on the top side via at least one contact stamp which is embedded in the sealing layer so that (i) its lower end is connected to a wiring level of an element substrate and (ii) its upper end is exposed in the surface of the sealing layer. |
| 申请公布号 |
US2014374917(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201414307055 |
申请日期 |
2014.06.17 |
| 申请人 |
WEBER Heribert;KUEPPERS Hartmut;Reutlingen Jens;DAVIES Neil |
发明人 |
WEBER Heribert;KUEPPERS Hartmut;Reutlingen Jens;DAVIES Neil |
| 分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component in the form of a wafer level package, comprising:
at least two element substrates assembled one above the other; a molded upper sealing layer of an electrically insulating casting compound; and at least one contact stamp via which an external electrical contacting of the component on the top side of the component is implement, the at least one contact stamp being embedded in the molded upper sealing layer such that (i) a lower end of the at least one contact stamp is connected to a wiring level of one of the element substrates and (ii) an upper end of the at least one contact stamp is exposed on the surface of the sealing layer. |
| 地址 |
Nuertingen DE |
