摘要 |
The present invention relates a camera module. The camera module according to the embodiment of the present invention includes a circuit board on which an image sensor is mounted, a housing which is combined with the circuit board and receives a lens barrel inside, and a shield case which surrounds the housing and includes an intensity reinforcement pattern to maintain flatness on one side thereof. The shield case includes a shield body, an opening hole, and the intensity reinforcement pattern. |