发明名称 CAMERA MODULE
摘要 The present invention relates a camera module. The camera module according to the embodiment of the present invention includes a circuit board on which an image sensor is mounted, a housing which is combined with the circuit board and receives a lens barrel inside, and a shield case which surrounds the housing and includes an intensity reinforcement pattern to maintain flatness on one side thereof. The shield case includes a shield body, an opening hole, and the intensity reinforcement pattern.
申请公布号 KR20140145846(A) 申请公布日期 2014.12.24
申请号 KR20130068529 申请日期 2013.06.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SON, KYOUNG SOO
分类号 G03B17/02 主分类号 G03B17/02
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