| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive silicone composition which can be filled into a module and imparts excellent electric insulation after being cured, and to provide a cured product of the silicone composition. <P>SOLUTION: The thermally conductive silicone composition includes: (A) an alkenyl group-containing organopolysiloxane represented by formula (1): R<SP POS="POST">1</SP><SB POS="POST">a</SB>R<SP POS="POST">2</SP><SB POS="POST">b</SB>SiO<SB POS="POST">(4-a-b)/2</SB>(wherein R<SP POS="POST">1</SP>is alkenyl; R<SP POS="POST">2</SP>is a monovalent hydrocarbon group not containing an aliphatic unsaturated bond; 0.0001≤a≤0.2; 1.7≤b≤2.2; and 1.9≤a+b≤2.4); (B) a triorganoxysilyl group-containing organopolysiloxane represented by formula (2): ((R<SP POS="POST">3</SP>O)<SB POS="POST">3</SB>SiO<SB POS="POST">1/2</SB>)<SB POS="POST">c</SB>(R<SP POS="POST">4</SP><SB POS="POST">2</SB>SiO)<SB POS="POST">d</SB>(R<SP POS="POST">5</SP>SiO<SB POS="POST">3/2</SB>)<SB POS="POST">e</SB>(wherein R<SP POS="POST">3</SP>is an organic group; R<SP POS="POST">4</SP>and R<SP POS="POST">5</SP>are each a monovalent hydrocarbon group; 0.00001≤c≤0.7; 0.3≤d≤0.99; 0≤e≤0.12; and c+d+e=1); (C) a thermally conductive filler; (D) an organohydrogenpolysiloxane represented by formula (3): R<SP POS="POST">6</SP><SB POS="POST">f</SB>H<SB POS="POST">g</SB>SiO<SB POS="POST">(4-f-g)/2</SB>(wherein R<SP POS="POST">6</SP>is a monovalent hydrocarbon group not containing an aliphatic unsaturated bond; 0.7≤f≤2.2; 0.001≤g≤0.5; and 0.8≤f+g≤2.5); and (E) a platinum-based catalyst. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
