| 摘要 |
The invention relates to a curable embossing compound which can be used for embossing lithography, consisting of a mixture of: at least one polymerizable main component and at least one auxiliary component. The invention further relates to a use of an embossing compound according to one of the preceding claims for the primary formation of an embossing mold (4, 4', 4", 4''', 4IV). |
