| 摘要 |
<p>An elastic substrate (10) is provided with a substrate (11) having elasticity and islands (15) which are embedded in the substrate (11) and which are relatively more rigid than the substrate (11). The islands (15) have first portions that become thinner progressively or stepwise toward the outside, on at least a portion of the perimeter of the islands (15). In addition, in a circuit board (1), electronic components (20) are disposed on the islands (16) and disposed on the substrate (11) so as to overlap the islands (15), and the electronic components (20) are connected together by wiring (30). The elastic substrate (10) mitigates changes in elongation (variation in hardness) between the substrate (11) and the islands (15) so as to weaken concentration of stress to the wiring (30) at the boundary portions between the substrate (11) and the islands (15), thereby suppressing breaking of the wiring (30).</p> |
