| 摘要 |
<p>According to the present invention, a deposition apparatus comprises: a first chamber inserted inside while a substrate is mounted on a tray; a deposition source located on the upper part of the first chamber to supply a sublimation material to the substrate on a lower part; a second chamber separated by a partition and equipped on the lower part of the first chamber to support a supporting part of the tray extended by being penetrated through the partition toward the outside of the lower part of the first chamber; and a pump to differential pump the first chamber and the second chamber individually. According to the present invention, the deposition apparatus is capable of depositing a substrate in a top-down linear method, and setting a deposition area in advance such that a sublimation material is uniformly deposited to the substrate in a top-down method. Therefore, the present invention has an effect of improving the efficiency and uniformity of deposition for the sublimation material when in comparison to the conventional bottom-up method or the conventional lateral side method; and efficiently downward guiding the sublimation material sublimated from the deposition source toward the substrate.</p> |
