发明名称 高周波回路とマイクロストリップ線路との結合構造、および高周波モジュール
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure for easily connecting a high frequency circuit with a microstrip line using a conducting wire, and provide a high frequency module. <P>SOLUTION: The structure for connecting the high frequency circuit with the microstrip line includes a high frequency component 30, a microstrip line, a second reference wiring 232, a first conducting wire 41, and second conducting wires 42 and 43. The high frequency component 30 has a high frequency circuit which includes a signal terminal 31 and reference potential terminals 32 and 33. The microstrip line includes a substrate 21, a signal wiring 22 for transmitting a high frequency signal, and a first reference wiring used as a reference potential of the signal wiring 22. The second reference wiring 232 is prepared on the substrate 21, located between the signal terminal 31 and the signal wiring 22, and electrically connected to the first reference wiring. The first conducting wire 41 is connected to the signal terminal 31, and extended from the high frequency component 30 toward the signal wiring 22, across the second reference wiring 232. The second conducting wires 42 and 43 are connected to the reference potential terminals 32 and 33, and extended from reference potential terminals 32 and 33 toward the signal wiring 22. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5645390(B2) 申请公布日期 2014.12.24
申请号 JP20090266241 申请日期 2009.11.24
申请人 发明人
分类号 H01P5/08;H01L23/12 主分类号 H01P5/08
代理机构 代理人
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