| 摘要 |
A three-dimensional milling method and apparatus is disclosed for milling micrometre and a nanometre scale three-dimensional structures. The apparatus includes an ion column operable to generate a milling beam onto a substrate held on an instrument stage. A patterning computer is operable to control the ion column to generate varying ion beam and/or dwell times or to produce a plurality of milling passes, in which subsequent passes overlap previous passes at least partially to create three-dimensional structures. Optionally, an SEM column may be provided. |
