| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is suitably usable for the formation of an insulating layer of a circuit board, particularly is excellent in the laminatability for the case of use in the form of an insulating resin sheet, has a low thermal expansion coefficient and besides permits the formation of a conductive layer having a high peeling strength even if the degree of roughness is low on the surface of the insulating layer obtained by curing the same; and to provide an insulating resin sheet. SOLUTION: The resin composition includes: (A) a polyfunctional epoxy resin; (B) a curing agent; (C) a phenoxy resin and/or a polyvinyl acetal resin; and (D) an inorganic filler which is surface-treated with a silazane compound and thereafter is surface-treated with a silane coupling agent, wherein the content of the component (D) is 50-80 mass% based on 100 mass% of the nonvolatile content of the resin composition. Moreover, an adhesive film is such that a layer of the resin composition is formed on a support film. Moreover, a prepreg is such that the resin composition is impregnated into a sheet-shaped fibrous base material made of fiber. COPYRIGHT: (C)2013,JPO&INPIT |
