发明名称 |
Light emitting device having vertical structure, package thereof and method for manufacturing the same |
摘要 |
A light emitting device having a vertical structure, a package thereof and a method for manufacturing the same, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity, are disclosed. The method includes growing a semiconductor layer having a multilayer structure over a substrate, forming a first electrode on the semiconductor layer, separating the substrate including the grown semiconductor layer into unit devices, bonding each of the separated unit devices on a sub-mount, separating the substrate from the semiconductor layer, and forming a second electrode on a surface of the semiconductor layer exposed in accordance with the separation of the substrate. |
申请公布号 |
EP2816613(A2) |
申请公布日期 |
2014.12.24 |
申请号 |
EP20140171213 |
申请日期 |
2007.02.12 |
申请人 |
LG ELECTRONICS, INC.;LG INNOTEK CO., LTD. |
发明人 |
JANG, JUN HO;KIM, GEUN HO |
分类号 |
H01L33/00;H01L25/16;H01L33/48 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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