发明名称 Dielectrophoretic cooling solution for electronics
摘要 At least one cooling channel (134) is positioned adjacent to an electronic component. The cooling channel (134) communicates with plenums (36,38) at each of two opposed axial ends. A dielectric fluid is received in the cooling channel (134). The cooling channel is provided with at least one electrode (50,56,62,64,66). A potential is applied to the at least one electrode (50,56,62,64,66) such that an electric field magnitude at the downstream end of the channel (134) is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel (134) will force it downstream.
申请公布号 EP2713393(A3) 申请公布日期 2014.12.24
申请号 EP20130186884 申请日期 2013.10.01
申请人 HAMILTON SUNDSTRAND CORPORATION 发明人 PEARSON, MATTHEW ROBERT;ST.ROCK, BRIAN
分类号 H01L23/473 主分类号 H01L23/473
代理机构 代理人
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