| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device capable of reducing damage to a substrate layer by lowering discharge voltage in performing sputtering film formation.SOLUTION: The film forming device includes an AC power source unit 50 alternately supplying voltage on a pair of targets 21A, 21B, and thermions are emitted from a filament 41 in an AC dual-cathode sputtering method. A discharge voltage of a plasma is lowered by supplying the thermions in a region where the plasma is formed, so that damage applied to a substrate layer is reduced in performing sputtering film formation. |
