发明名称 CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR
摘要 A contact assembly (102) includes a conductive substrate (202), a composite layer (204), and a conductive layer (206). The conductive substrate (202) is configured to form a conductive path of the electrical connector (100). The composite layer (204) is engaged to the conductive substrate (202) and includes a dielectric material (514) with a conductive filler material (508) dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration (708) of the composite layer. The conductive layer (206) is engaged to the composite layer (204). The conductive substrate (202), the composite layer (204), and the conductive layer (206) form a capacitive element through which a signal propagation path (402) between the conductive substrate (202) and a mating contact (400) that mates with the conductive layer (206) passes.
申请公布号 EP2815463(A1) 申请公布日期 2014.12.24
申请号 EP20130703497 申请日期 2013.01.30
申请人 TYCO ELECTRONICS CORPORATION 发明人 SULLIVAN MALERVY, MARY ELIZABETH
分类号 H01R13/03;H01R4/58;H01R13/658 主分类号 H01R13/03
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