Light emitting device and light emitting device package

摘要

Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure (110) including a first conductive semiconductor layer (112), an active layer (114) on the first conductive semiconductor layer, and a second conductive semiconductor layer (116) on the active layer, an adhesive layer (130) contacting a top surface of the first conductive semiconductor layer, a first electrode (150) contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode (140) contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.