| 摘要 |
In order to provide a physical quantity measuring apparatus wherein influence of heat, excluding heat of a gas to be measured, can be reduced with respect to a measuring section that measures a physical quantity relating to the gas to be measured, the present invention is provided with: a chip package (40), wherein first and second measuring sections for measuring first and second physical quantities relating to the gas to be measured, and a signal processing section, which is connected to the first and second measuring sections, and which processes signals transmitted from the first and second measuring sections, are formed by molding a polymer resin; and a casing (11), which fixes and houses the chip package (40) therein, and which has formed therein first and second bypass paths (12, 14) for flowing the gas to be measured, said gas having been taken to the first measuring section through a main path (70). In the chip package (40), a signal processing section (44) is disposed between the first and second measuring sections, and a cooling section that cools the signal processing section (44) by making the gas to be measured flow between the first measuring section and the second measuring section is formed in the casing (11), said gas to be measured having been supplied through the main paths (70). |
