THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES

摘要

An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly (402), a module board, heat-generating components (150), and a thermally conductive plate (200). The lens assembly is secured to the module board. The module board includes a printed circuit board (PCB). The heat-generating components is mounted to the PCB. The thermally conductive plate is secured to a surface (134) of the module board. The thermally conductive plate defines an opening (208) that receives at least a portion of the lens assembly. The thermally conductive plate is configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.