| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device which can properly achieve downsizing.SOLUTION: A semiconductor light-emitting device comprises a first lead frame, a second lead frame, a semiconductor light-emitting element and a case, in which the first lead frame includes a bonding part and a first extension part. A first coated surface of the first extension part is parallel with a first rear face of the bonding part and located closer than the first rear face of the bonding part to an emission direction side in a third direction. The case has a frame-like part which covers a top face of the first extension part in an adhering manner and a first wrapping part which covers the first coated surface of the first extension part in an adhering manner. Thicknesses of the first terminal part, the second terminal part and the bonding part are the same. The first terminal part, the second terminal part, the bonding part and the first wrapping part are flush with each other. |
