RADIO FREQUENCY TRANSISTOR AND MATCHING CIRCUIT GROUNDING AND THERMAL MANAGEMENT APPARATUS

摘要

In a communication device, a heat sink (110) includes a solderable top surface with multiple upward facing swaging protrusions (112). A spacer (106) is placed on top of the top surface of the heat sink with locating cut-outs (118) on the spacer aligned with the swaging protrusions. A solder pre form (104) is inserted into an opening (114) in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board (102) including cut-outs and input and output connections for inserting a radio frequency device (108) and further including locating holes (120) for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.