| 摘要 |
An electronic apparatus is provided with a substrate (10), electronic components (20, 30), a mold resin (40), rod-like connection terminals (65), and a case (60). The substrate has one surface (11) and another surface (12) which is to be the opposite surface of the first-mentioned one surface, and wiring patterns and through-holes (13) connected to the wiring patterns are formed on the substrate. The electronic components are mounted on the one surface side of the substrate. The mold resin seals the electronic components on the one surface side of the substrate. The connection terminals are inserted from the tips into the through-holes, and are electrically connected to the through-holes. The case has a surface (61) on which the connection terminals have been erected, and houses the substrate on which the electronic components have been mounted. For the substrate, the one surface of the side on which the electronic components and the mold resin have been disposed is disposed so as to face the surface side on which the connection terminals have been erected in the case. |
