| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package which has high reliability and excellent productivity.SOLUTION: A semiconductor package in which a semiconductor chip 1 is mounted on a substrate 3 via an adhesive layer comprises fillets 2 which cover sidewalls Y of the semiconductor chip but do not cover a top face of the semiconductor chip. When assuming that a maximum width of the fillet from the sidewall of the semiconductor chip is a, and a maximum height of the fillet from a surface of the substrate is b, and a distance from the surface of the substrate to the top face of the semiconductor chip is T, the semiconductor chip package satisfies the following formulas (1) and (2): T<b (1); 0.5b<a<1.5b (2).</p> |
