| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method capable of reducing deformation of a substrate such as a semiconductor wafer, and stress applied on the substrate, and safely performing sucking to a top ring of the substrate by preventing defects of the substrate and damage to the substrate.SOLUTION: A polishing method using a polishing device comprises: a polishing table 100a comprising a polishing surface 101a; a top ring 1 for pressing a substrate to the polishing surface 101a while retaining the substrate; and a vertically moving mechanism 24 for vertically moving the top ring 1. In the polishing method, the top ring 1 is moved to predetermined height in a state in which the substrate is in contact against the polishing surface 101a, and the substrate is suck to the top ring 1 from the polishing surface 101a, after the top ring 1 is moved, or at the same time as movement of the top ring 1. |
