| 摘要 |
An encapsulating sheet (1), for encapsulating an optical semiconductor element (5), includes an embedding layer (2) for embedding the optical semiconductor element and a gas barrier layer (3) provided at one side in a thickness direction of the embedding layer (2), having a thickness of 50 µm or more and 1,000 µm or less, and for suppressing the passing of a gas in the thickness direction. |
