发明名称 Semiconductor device and manufacturing method thereof
摘要 <p>A semiconductor device includes a first semiconductor layer (21) formed of a nitride semiconductor on a substrate (11); a second semiconductor layer (22) formed of a nitride semiconductor on the first semiconductor layer; an insulation film (30) including an opening, and being formed on the second semiconductor layer; a source electrode (42) and a drain electrode (43) formed on the second semiconductor layer; and a gate electrode (41) formed at the opening on the second semiconductor layer. Both the insulation film and the second semiconductor layer include carbon in a neighborhood of an interface between the insulation film and the second semiconductor layer.</p>
申请公布号 EP2816606(A1) 申请公布日期 2014.12.24
申请号 EP20140172259 申请日期 2014.06.13
申请人 FUJITSU LIMITED 发明人 KAMADA, YOUICHI;OZAKI, SHIROU;OHKI, TOSHIHIRO;MAKIYAMA, KOZO;OKAMOTO, NAOYA
分类号 H01L29/778;H01L23/29;H01L23/31;H01L29/20;H01L29/207;H01L29/417 主分类号 H01L29/778
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