发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
<p>A semiconductor device includes a first semiconductor layer (21) formed of a nitride semiconductor on a substrate (11); a second semiconductor layer (22) formed of a nitride semiconductor on the first semiconductor layer; an insulation film (30) including an opening, and being formed on the second semiconductor layer; a source electrode (42) and a drain electrode (43) formed on the second semiconductor layer; and a gate electrode (41) formed at the opening on the second semiconductor layer. Both the insulation film and the second semiconductor layer include carbon in a neighborhood of an interface between the insulation film and the second semiconductor layer.</p> |
申请公布号 |
EP2816606(A1) |
申请公布日期 |
2014.12.24 |
申请号 |
EP20140172259 |
申请日期 |
2014.06.13 |
申请人 |
FUJITSU LIMITED |
发明人 |
KAMADA, YOUICHI;OZAKI, SHIROU;OHKI, TOSHIHIRO;MAKIYAMA, KOZO;OKAMOTO, NAOYA |
分类号 |
H01L29/778;H01L23/29;H01L23/31;H01L29/20;H01L29/207;H01L29/417 |
主分类号 |
H01L29/778 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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