发明名称 VACUUM CHUCK
摘要 A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.
申请公布号 KR20140146139(A) 申请公布日期 2014.12.24
申请号 KR20147029699 申请日期 2012.03.28
申请人 ACM RESEARCH (SHANGHAI) INC. 发明人 WANG JIAN;JIN YINUO;SHAO YONG;WANG HUI
分类号 H01L21/683;B23Q3/08;B25B11/00;B25J15/06;H01L21/67 主分类号 H01L21/683
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