| 摘要 |
<p>A chip package comprises a complex substrate and a chip. The complex substrate comprises a core substrate, an adiabatic layer which is installed on the core substrate, and a penetration hole which penetrates the core substrate and the adiabatic layer. A chip is fixed on the core substrate and is buried within the adiabatic layer. An upper electrode of the chip is connected to a first wire layer. The first wire layer is arranged on the upper side of the adiabatic layer, the lower side of the core substrate, and in the penetration hole. The lower electrode of the chip is connected to a second wire layer. The second wire layer is arranged on the lower side of the core substrate. The chip package simplifies manufacturing processes and reduces manufacturing costs and a package volume.</p> |
