Structures and methods for RF de-embedding

摘要

Electrical structures, methods, and computer program products for radio frequency (RF) de-embedding are provided. A structure includes a first test device, a first through structure corresponding to the first test device, and a first open structure corresponding to the first test device. The structure also includes a second test device having at least one different physical dimension than the first test device but otherwise identical to the first test device, a second through structure corresponding to the second test device, and a second open structure corresponding to the second test device. A method includes determining a first electrical parameter of the first test device in a first DUT structure and a second electrical parameter of the second test device in a second DUT structure based on measured electrical parameters of the first and the second DUT structures, through structures, and open structures.

主权项

1. A structure, comprising:
a first set of test structures comprising:
a first device under test (DUT) structure comprising a first capacitor having a first length;a first through structure corresponding to the first DUT structure; anda first open structure corresponding to the first DUT structure; and a second set of test structures comprising:
a second device under test (DUT) structure comprising a second capacitor having a second length different than the first length but otherwise identical to the first capacitor;a second through structure corresponding to the second DUT structure; anda second open structure corresponding to the second DUT structure.