Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface

摘要

A semiconductor device has a semiconductor die with a plurality of bumps formed on contact pads disposed over its active surface. An encapsulant is formed over the semiconductor die. An interconnect structure is formed over the semiconductor die and encapsulant. The semiconductor die is mounted to a translucent tape with the bumps embedded in the translucent tape. The translucent tape has layers of polyolefin, acrylic, and polyethylene terephthalate. A back surface of the semiconductor die undergoes backgrinding to reduce die thickness. The tape undergoes UV curing. A laminate layer is formed over the back surface of the semiconductor die. The laminate layer undergoes oven curing. The laminate layer is laser-marked while the tape remains applied to the bumps. The tape is removed after laser-marking the laminate layer. Alternately, the tape can be removed prior to laser-marking. The tape reduces die warpage during laser-marking.

主权项

1. A method of making a semiconductor device, comprising:
providing a translucent tape; providing a semiconductor substrate; depositing an encapsulant over the semiconductor substrate; forming an interconnect structure over the semiconductor substrate and encapsulant, the interconnect structure including a redistribution layer and plurality of bumps coupled to the redistribution layer; disposing the semiconductor substrate on the translucent tape with the bumps embedded in the translucent tape; removing a portion of the semiconductor substrate and encapsulant opposite the interconnect structure; forming a laminate layer over a surface of the semiconductor substrate and encapsulant opposite the interconnect structure; laser-marking the laminate layer controlled by pattern recognition through the translucent tape with the bumps embedded in the translucent tape; and removing the translucent tape after laser-marking the laminate layer.