Method for integrating an electronic component into a printed circuit board

摘要

The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component (4) comprising contacts (6) oriented towards an insulating layer (1) which is fixed to a laminate consisting of a conductive layer (2) and a insulating layer (1). Once the component (4) has been fixed to the insulating layer (1), at least one hole or perforation (8, 11) corresponding to the contacts (6) of the component (4) are formed in the conducting layer (2) and in the insulating layer (1), the contacts come into contact with the conducting layer (2), enabling a reliable integration or embedding of an electronic component (4) into a printed circuit board.

主权项

1. A method for integrating an electronic component into a printed circuit board, comprising the following steps in the following sequence:
providing a laminate comprising an electric conductive layer and an electric insulating layer; forming at least one marker in the insulating layer for registering and aligning the electronic component on the insulating layer, wherein the at least one marker is formed by a bore or perforation penetrating both the insulating layer and the conductive layer; fixing the electronic component to the insulating layer, the electronic component comprising extrusions oriented towards the insulating layer; forming holes or perforations in the conductive layer at locations near the extrusions of the electronic component by using an UV laser; forming holes or perforations in the insulating layer at locations near the extrusions of the electronic component; and connecting the extrusions with the conductive layer.