| 摘要 |
An object of the present invention is to provide a copper alloy plate with high strength, high electric conductivity, high modulus of bending deflection, and excellent stress relaxation characteristic; and a high-current electronic part and a heat-radiating electronic part by the copper alloy plate. The copper alloy plate contains 0.005-0.25 wt% of Sn, has a remaining portion formed of copper and inevitable impurities, has tensile strength equal to or greater than 350 MPa, and has an A value calculated by the following equation equal to or greater than 0.5. A = 2X_(111) + X_(220) - X_(200) X_(hk1) = I_(hk1)/I_0(hk1) (provided that I_(hk1) and I_0(hk1) are diffraction integral strengths of the (hk1) surface calculated with respect to a rolling surface and copper ashes using an x-ray diffraction method). |
