发明名称 |
Enhanced hydrogen barrier encapsulation method for the control of hydrogen induced degradation of ferroelectric capacitors in an F-RAM process |
摘要 |
A method of encapsulating a ferroelectric capacitor or ferroelectric memory cell includes forming encapsulation materials adjacent to a ferroelectric capacitor. forming a ferroelectric oxide (FEO) layer over the encapsulated ferroelectric capacitor, and forming an FEO encapsulation layer over the ferroelectric oxide to provide additional protection from hydrogen induced degradation. |
申请公布号 |
US8916434(B2) |
申请公布日期 |
2014.12.23 |
申请号 |
US201213470117 |
申请日期 |
2012.05.11 |
申请人 |
Cypress Semiconductor Corporation |
发明人 |
Sun Shan;Davenport Thomas E. |
分类号 |
H01L29/76 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
1. A method of encapsulating a ferroelectric capacitor, comprising:
forming a ferroelectric oxide (FEO) over an encapsulated ferroelectric capacitor, the ferroelectric oxide comprising a dielectric material; planarizing the FEO by chemical mechanical polishing to form a planarized FEO; forming FEO encapsulation materials over the planarized FEO; and forming a metal 1 (M1) layer over the FEO encapsulation materials, wherein forming the FEO encapsulation materials comprise an encapsulation layer and a barrier layer overlying the encapsulation layer to prevent a reaction between the encapsulation layer and the M1 layer, wherein the encapsulation layer and the barrier layer are each between 50 and 1000 Angstroms thick. |
地址 |
San Jose CA US |