Method for producing an electronic component and electronic component

摘要

A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).

主权项

1. A method for producing an electronic component comprising barrier layers for the encapsulation of the component, comprising the steps of:
providing a substrate with at least one functional layer; applying at least one first barrier layer on the at least one functional layer by plasmaless atomic layer deposition; applying at least one second barrier layer on the at least one functional layer by plasma-enhanced chemical vapor deposition; applying a protective layer on the at least one first barrier layer and the at least one second barrier layer, wherein the protective layer includes a plastic and has a thickness of greater than or equal to 10 μm; and obtaining a layer sequence composed of at least two layers comprising different materials and applying said layer sequence as the at least one second barrier layer.