Package structures to improve on-chip antenna performance

摘要

A radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure. The integrated antenna structure includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure of the RFIC chip. The antenna structure further includes a superstrate structure disposed on the back-end-of-line structure of the RFIC chip. The superstrate structure includes at least one substrate layer and a focusing metal element. The focusing metal element has a structure that is complementary to the on-chip radiator elements and which is configured to focus electromagnetic radiation to and from the planar antenna structure. The superstrate structure improves the performance (e.g., antenna gain and bandwidth) of the on-chip antennas for millimeter-wave applications.

主权项

1. A package structure, comprising:
an RFIC (radio frequency integrated circuit) chip comprising a semiconductor substrate having an active surface and an inactive surface, and a BEOL (back end of line) structure formed on the active surface of the semiconductor substrate; and an antenna structure comprising:
a planar antenna having one or more radiator elements formed as part of the BEOL structure of the RFIC chip; anda superstrate structure disposed on a surface of the BEOL structure adjacent planar antenna, the superstrate structure comprising at least one substrate layer and a focusing metal element disposed on a surface of the at least one substrate and aligned to the one or more radiator elements of the planar antenna, wherein the focusing metal element has a structure that is complementary to the one or more radiator elements of the planar antenna and configured to focus electromagnetic radiation to and from the planar antenna structure.