发明名称 Method for manufacturing a carbon nanotube field emission device with overhanging gate
摘要 A carbon nanotube field emission device with overhanging gate fabricated by a double silicon-on-insulator process. Other embodiments are described and claimed.
申请公布号 US8916394(B2) 申请公布日期 2014.12.23
申请号 US201313919842 申请日期 2013.06.17
申请人 California Institute of Technology 发明人 Toda Risaku;Bronikowski Michael J.;Luong Edward M.;Manohara Harish
分类号 H01L21/302;H01J3/02;H01J1/304;B82Y10/00;B82Y20/00;H01J9/02;B82Y40/00 主分类号 H01L21/302
代理机构 Steinfl & Bruno, LLP 代理人 Steinfl & Bruno, LLP
主权项 1. A semiconductor process applied to a wafer, the wafer comprising a silicon substrate; a first insulator layer on the silicon substrate; a first silicon layer on the first insulator layer; a second insulator layer on the first silicon layer; and a second silicon layer on the second insulator layer; the semiconductor process comprising: etching through the second silicon layer, through the second insulator layer, and through the first silicon layer to the first insulator layer to define a hole; lateral etching in the first silicon layer to laterally enlarge the hole at the first silicon layer; etching through the first insulator layer to the substrate, so that the hole has a bottom that includes the substrate; depositing a removable material on the wafer; and forming an array of carbon nanotubes at the bottom of the hole on the substrate.
地址 Pasadena CA US