发明名称 |
Method for manufacturing a carbon nanotube field emission device with overhanging gate |
摘要 |
A carbon nanotube field emission device with overhanging gate fabricated by a double silicon-on-insulator process. Other embodiments are described and claimed. |
申请公布号 |
US8916394(B2) |
申请公布日期 |
2014.12.23 |
申请号 |
US201313919842 |
申请日期 |
2013.06.17 |
申请人 |
California Institute of Technology |
发明人 |
Toda Risaku;Bronikowski Michael J.;Luong Edward M.;Manohara Harish |
分类号 |
H01L21/302;H01J3/02;H01J1/304;B82Y10/00;B82Y20/00;H01J9/02;B82Y40/00 |
主分类号 |
H01L21/302 |
代理机构 |
Steinfl & Bruno, LLP |
代理人 |
Steinfl & Bruno, LLP |
主权项 |
1. A semiconductor process applied to a wafer, the wafer comprising a silicon substrate; a first insulator layer on the silicon substrate; a first silicon layer on the first insulator layer; a second insulator layer on the first silicon layer; and a second silicon layer on the second insulator layer; the semiconductor process comprising:
etching through the second silicon layer, through the second insulator layer, and through the first silicon layer to the first insulator layer to define a hole; lateral etching in the first silicon layer to laterally enlarge the hole at the first silicon layer; etching through the first insulator layer to the substrate, so that the hole has a bottom that includes the substrate; depositing a removable material on the wafer; and forming an array of carbon nanotubes at the bottom of the hole on the substrate. |
地址 |
Pasadena CA US |