| 发明名称 | Semiconductor devices, packaging methods and structures | ||
| 摘要 | Semiconductor devices, packaging methods and structures are disclosed. In one embodiment, a semiconductor device includes an integrated circuit die with a surface having a peripheral region and a central region. A plurality of bumps is disposed on the surface of the integrated circuit die in the peripheral region. A spacer is disposed on the surface of the integrated circuit die in the central region. | ||
| 申请公布号 | US8916969(B2) | 申请公布日期 | 2014.12.23 |
| 申请号 | US201113194606 | 申请日期 | 2011.07.29 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chen Yu-Ren;Tseng Ming Hung;Lai Yi-Jen |
| 分类号 | H01L23/48;H01L23/52;H01L23/16;H01L23/00;H01L23/31;H01L21/56 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A semiconductor device, comprising: an integrated circuit die, the integrated circuit die comprising a surface having a peripheral region and a central region: a plurality of bumps disposed on the surface of the integrated circuit die in the peripheral region; a substrate, the plurality of bumps electrically coupling the integrated circuit die to the substrate; and a spacer disposed between only the central region of the integrated circuit die and the substrate, the spacer being adhered to only one of the integrated circuit die and the substrate along an axis orthogonal to a major surface of the substrate and having a thickness less than a distance between the integrated circuit die and the substrate, the axis passing through the spacer. | ||
| 地址 | Hsin-Chu TW | ||