| 发明名称 | Packaging structure | ||
| 摘要 | A packaging structure is provided. The packaging structure includes first and second chips, at least one surface of each of the first and second chips being an active surface and a common chip to which at least one of the first and second chips is electrically interconnected. The respective active surfaces of the first and second chips are directly electrically interconnected to one another in a face-to-face arrangement and are oriented transversely with respect to the common chip. | ||
| 申请公布号 | US8916959(B2) | 申请公布日期 | 2014.12.23 |
| 申请号 | US201213721991 | 申请日期 | 2012.12.20 |
| 申请人 | International Business Machines Corporation | 发明人 | Colgan Evan G.;Coteus Paul W.;Wisnieff Robert L. |
| 分类号 | H01L23/02;H01L23/52;H01L23/48;H01L27/146;H01L23/538;H01L23/00 | 主分类号 | H01L23/02 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP ;Stock William |
| 主权项 | 1. A packaging structure, comprising: first and second chips; at least one surface of each of the first and second chips being an active surface; and a common chip to which a sidewall of at least one of the first and second chips is electrically interconnected, the sidewall being adjacent and transverse to the active surface; the respective active surfaces of the first and second chips being directly electrically interconnected to one another in a face-to-face arrangement and being oriented transversely with respect to the common chip. | ||
| 地址 | Armonk NY US | ||