| 摘要 |
<p>An embodiment relates to a light emitting device. The light emitting device according to an embodiment of the present invention includes: a first conductive semiconductor layer; an active layer which is formed on the first conductive semiconductor layer; a second conductive semiconductor layer which is formed on the active layer; a light emitting chip which includes a first pad which is arranged on the first conductive semiconductor layer; a first wire which has a first protrusion of a ball type bonded on the first pad; and a first bonding member which is bonded on the surface of the first protrusion and the first pad. The upper side of the first bonding member is arranged to be lower than the highest height of the first wire.</p> |
