UBM structures for wafer level chip scale packaging

摘要

A wafer level chip scale semiconductor device comprises a semiconductor die, a first under bump metal structure and a second under bump metal structure. The first under bump metal structure having a first enclosure is formed on a corner region or an edge region of the semiconductor die. A second under bump metal structure having a second enclosure is formed on an inner region of the semiconductor die. The first enclosure is greater than the second enclosure.

主权项

1. A method comprising:
forming a first redistribution line pad and a second redistribution line pad over a substrate, wherein the first redistribution line pad is in an inner region of the substrate and the second redistribution line pad is in an outer region of the substrate; forming a first under bump metal structure over the first redistribution line pad; and forming a second under bump metal structure over the second redistribution line pad, wherein a gap between the second under bump metal structure and the second redistribution line pad is greater than a gap between the first under bump metal structure and the first redistribution line pad.