Structures and methods for improving solder bump connections in semiconductor devices

摘要

Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.

主权项

1. A method of manufacturing a semiconductor structure, comprising:
forming a capture pad structure over an insulative material and a via formed therein to contact an underlying contact pad; segmenting the capture pad structure over the insulative material surrounding the via such that openings are formed in the capture pad structure over the insulative material to form a plurality of capture pad structure openings surrounding the via; and forming a solder bump over capture pad structure and between the segments.