发明名称 |
Multi-stack cure system and method of operating the same |
摘要 |
Provided is a multi-stack cure system. The system includes a chamber having an inlet port and an outlet port. A magazine is mounted in the chamber. A plurality of substrates having encapsulants are loaded in the magazine. A heater is mounted at the chamber and serves to heat the plurality of substrates having the encapsulants. A loading unit is positioned adjacent the inlet port. The loading unit has a transfer device and a push bar. A substrate recognition device is mounted in the loading unit. A control device is connected to the substrate recognition device. The inlet port has a size larger than each of the plurality of substrates having the encapsulants and smaller than the magazine. |
申请公布号 |
US8916105(B2) |
申请公布日期 |
2014.12.23 |
申请号 |
US201313759672 |
申请日期 |
2013.02.05 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Park Jung-Gyu |
分类号 |
B01J19/00;H01L21/677;B01J19/24;B05D3/00;B05D3/02;B05D3/04;B05D3/06;B05D3/10;B05D3/14;H01L21/67 |
主分类号 |
B01J19/00 |
代理机构 |
Onello & Mello, LLP |
代理人 |
Onello & Mello, LLP |
主权项 |
1. A multi-stack cure system comprising:
a chamber having an inlet port and an outlet port; a magazine in the chamber, wherein a plurality of substrates having encapsulants is loaded into the magazine; a heater mounted at the chamber, the heater constructed and arranged to heat the plurality of substrates having the encapsulants; a loading unit adjacent to the inlet port and having a transfer device and a push bar; a substrate recognition device at the loading unit; and a control device coupled to the substrate recognition device, wherein the inlet port has a size that is larger than each of the plurality of substrates having the encapsulants and smaller than the magazine. |
地址 |
KR |