发明名称 Multi-stack cure system and method of operating the same
摘要 Provided is a multi-stack cure system. The system includes a chamber having an inlet port and an outlet port. A magazine is mounted in the chamber. A plurality of substrates having encapsulants are loaded in the magazine. A heater is mounted at the chamber and serves to heat the plurality of substrates having the encapsulants. A loading unit is positioned adjacent the inlet port. The loading unit has a transfer device and a push bar. A substrate recognition device is mounted in the loading unit. A control device is connected to the substrate recognition device. The inlet port has a size larger than each of the plurality of substrates having the encapsulants and smaller than the magazine.
申请公布号 US8916105(B2) 申请公布日期 2014.12.23
申请号 US201313759672 申请日期 2013.02.05
申请人 Samsung Electronics Co., Ltd. 发明人 Park Jung-Gyu
分类号 B01J19/00;H01L21/677;B01J19/24;B05D3/00;B05D3/02;B05D3/04;B05D3/06;B05D3/10;B05D3/14;H01L21/67 主分类号 B01J19/00
代理机构 Onello & Mello, LLP 代理人 Onello & Mello, LLP
主权项 1. A multi-stack cure system comprising: a chamber having an inlet port and an outlet port; a magazine in the chamber, wherein a plurality of substrates having encapsulants is loaded into the magazine; a heater mounted at the chamber, the heater constructed and arranged to heat the plurality of substrates having the encapsulants; a loading unit adjacent to the inlet port and having a transfer device and a push bar; a substrate recognition device at the loading unit; and a control device coupled to the substrate recognition device, wherein the inlet port has a size that is larger than each of the plurality of substrates having the encapsulants and smaller than the magazine.
地址 KR
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