Circuit board production method and circuit board

摘要

Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil (30) having one turn is formed in a planar shape from a metal plate. Next, a second coil (40) having four turns is formed in a planar shape from a metal plate, wherein both of the ends (41, 42) of the coil are linked to other adjacent regions via linking portions (43, 44). A pair of the first coil (30) and the second coil (40) are then overlapped so as to face each other through a plastic plate (50) in which a plurality of prepregs are stacked, after which the links by the linking portions (43, 44) are disconnected.

主权项

1. A circuit board comprising:
an insulating member having a plate shape, and including a through hole configured to allow a die punching tool to pass through the insulating member; a first circuit pattern and a second circuit pattern formed by die punching of a conductor having a plate shape in a manner that the first and second circuit patterns are coupled with each other by a first coupling section; wherein the first circuit pattern and the second circuit pattern are secured to a front surface of the insulating member by an adhesive, wherein the first coupling section faces the through hole of the insulating member a third circuit pattern secured to a back surface of the insulating member by an adhesive, and the first coupling section is configured to be removed in order to electrically isolate the first circuit pattern and the second circuit pattern from each other after the insulating member having the through hole is secured to the first circuit pattern and the second circuit pattern.