发明名称 Circuit board having bypass pad
摘要 An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.
申请公布号 US8917107(B2) 申请公布日期 2014.12.23
申请号 US201213563258 申请日期 2012.07.31
申请人 Samsung Electronics Co., Ltd. 发明人 Han Sang-Guk;Moon Seok-Joon;Jin Beom-jun
分类号 G01R31/00;G01R31/28;H01L23/538;H05K1/02;H01L21/66;H01L23/00;H01L25/065;H01L25/18;H05K1/11;H05K3/28;H05K3/32 主分类号 G01R31/00
代理机构 Muir Patent Consulting, PLLC 代理人 Muir Patent Consulting, PLLC
主权项 1. A solid state disk comprising: a logic chip; one or more memory chips; and a printed circuit board including; a substrate including a first surface and a second surface opposite to the first surface;connector formed on the second surface of the substrate and configured to be coupled to external devices;a plurality of bypass pads; and a solder resist layer covering the plurality of bypass pads formed on the second surface of the substrate.
地址 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do KR