Multi-layered circuit board and electro-static discharge protection structure

摘要

An electro-static discharge (ESD) protection structure includes a first insulation layer (having a first surface, a second surface opposite to the first surface, and a through hole), a patterned conductive layer (located on the first surface), an electro-static releasing layer (located on the second surface), and a solder mask layer. At least one portion of the patterned conductive layer surrounds the through hole. The electro-static releasing layer is electrically insulated from the patterned conductive layer. At least one portion of the electro-static releasing layer is around the through hole. The solder mask layer covers the first insulation layer and a portion of the patterned conductive layer and exposes a portion of the patterned conductive layer surrounding the through hole. A multi-layered circuit board including a second insulation layer, a power supply layer, a third insulation layer and the ESD protection structure is also provided.

主权项

1. A multi-layered circuit board comprising:
a first insulation layer having a first surface, a second surface opposite to the first surface, and at least one through hole; a patterned conductive layer located on the first surface, at least one portion of the patterned conductive layer surrounding the through hole; an electro-static releasing layer located on the second surface and electrically insulated from the patterned conductive layer, at least one portion of the electro-static releasing layer being located around the through hole; a second insulation layer located below the first insulation layer, such that the electro-static releasing layer is sandwiched between the first insulation layer and the second insulation layer; a power supply layer located below the second insulation layer, the power supply layer and the electro-static releasing layer being respectively located at two opposite sides of the second insulation layer; and a third insulation layer located below the second insulation layer, such that the power supply layer is sandwiched between the second insulation layer and the third insulation layer, wherein the through hole is formed in the second insulation layer, the power supply layer, and the third insulation layer, and there is no conductive material within the through hole.