BONDING APPARATUS FOR FLEXIBLE PCB

摘要

The present invention relates to a bonding apparatus for a flexible PCB. The bonding apparatus for a flexible PCB includes: an ACF bonding unit which performs bonding in order to attach an anisotropic conductive film to one side of a panel; a preliminary bonding unit which performs bonding in order to preparatively mount a flexible PCB on the panel to which the film is attached; a primary bonding unit which performs bonding in order to finally mount the flexible PCB on the panel supplied from the preliminary bonding unit; and a control unit which rotates the panel or the flexible PCB so that the film attached to the panel is positioned on the lower surface of the flexible PCB, after attaching the film by the ACF bonding unit. Accordingly, the present invention is able to: perform not only a manufacturing process of a flexible PCB but also a manufacturing process of a different kind of substrate such as a COG, an FOG, an OLB, etc.; perform a bonding process regardless of the position of a mounted surface; and increase the accuracy of bonding.