发明名称 |
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME |
摘要 |
<p>Disclosed are a packaging substrate and a method of fabricating the same. The packaging substrate includes a core layer which has trench parts and ridge parts on a surface, a first trace located on the bottom surface of the trench parts; and a second trace located in the upper part of the ridge parts.</p> |
申请公布号 |
KR20140144487(A) |
申请公布日期 |
2014.12.19 |
申请号 |
KR20130066494 |
申请日期 |
2013.06.11 |
申请人 |
SK HYNIX INC. |
发明人 |
SEO, HYUN CHUL;KIM, JONG HOON;YU, JAE WOONG |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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