IMPEDANCE MATCHING AND ONE ELECTROMAGNETIC SHIELDING TYPE RELATIONSHIP LIMIT FILM

摘要

The present invention relates to an impedance matching and electromagnetic wave shield integrated insulating film. An objective of the present invention is to provide an impedance matching and electromagnetic wave shield integrated insulating film which is capable of performing an impedance matching and an electromagnetic wave shield while being manufactured through a simple process to reduce the manufacturing cost. To this end, an impedance matching and electromagnetic wave shield integrated insulating film includes an insulating film layer is formed on an insulating film, wherein an insulating adhesive is coated on one surface of the insulating film and the insulating film is allowed to stay in a curing room at inner temperature of 50°C ~ 70°C for 24 ~ 48 hours in order to stabilize the insulating adhesive; an impedance matching and electromagnetic wave shielding layer adhering to the other surface of the insulating film layer through the medium of integrated adhesive to shield the impedance matching and the electromagnetic wave; and a release sheet adhering to the other surface of the insulating adhesive attached on one surface of the insulating film layer to prevent the insulating adhesive from being stained with foreign materials, wherein the impedance matching and electromagnetic wave integrated shielding is allowed to secondarily stay in the curing room at inner temperature of 50°C ~ 70°C for 24 ~ 48 hours in order to stabilize the integrating adhesive coated on the other surface of the insulating film layer.