| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of suppressing connection failure between a wiring sheet and a semiconductor chip, and improving adhesion between a sealing sheet and a wiring sheet.SOLUTION: A method of manufacturing a semiconductor device includes a step A for preparing a laminate in which at least a temporary fitting sheet and a wiring sheet where re-wiring layer is formed are stacked, a step B for flip-chip mounting a semiconductor chip on the wiring sheet of the laminate, a step C for preparing a sealing sheet provided by plastic-processing a kneaded object obtained by kneading epoxy resin, curing agent, and inorganic filler agent, a step D in which the sealing sheet is arranged on a surface on the side where the semiconductor chip appears and the semiconductor chip is embedded in the sealing sheet, a step E for thermally curing the sealing sheet, and a step F for peeling the temporary fitting sheet from the wiring sheet.</p> |
